{"artifact":{"id":"art-2024q3-skhynix-pmt","dedupe_key":"5dd122b726eb2ae2cb19843f6041648ed0f3769319abf2d1d55fa3fa645c87b6","canonical_url":"https://news.skhynix.com/en/preliminary-mou-terms-signed-with-us-doc-for-advanced-packaging-facility-in-indiana/","evidence_locator":"","artifact_type":"official_announcement","title":"SK hynix signs preliminary US packaging funding terms","summary":"SK hynix signed preliminary CHIPS terms for proposed support of an Indiana advanced packaging facility.","creator_entities":["SK hynix"],"released_at":"2024-08-06T00:00:00.000Z","content_hash":null,"metadata":{"historical_scope":"2024-Q3"},"created_at":"2026-10-10T07:49:15.902Z","updated_at":"2026-10-10T07:49:15.902Z"},"sources":[{"id":"src-2024q3-skhynix-pmt","dedupe_key":"ab509079e4ebea18a73a972da1042aa5ae6ce4bf1b3bd3db623f4f8c16999901","name":"SK hynix signs preliminary US packaging funding terms","publisher":"SK hynix","url":"https://news.skhynix.com/en/preliminary-mou-terms-signed-with-us-doc-for-advanced-packaging-facility-in-indiana/","evidence_locator":"","source_type":"official_announcement","primary_or_secondary":"primary","retrieved_at":"2026-10-09T19:12:47.000Z","published_at":"2024-08-06T00:00:00.000Z","author":null,"metadata":{"time_precision":"day","evidence_locator":"Original dated article body; exclude navigation and subsequent updates","historical_scope":"2024-Q3"},"created_at":"2026-10-10T07:49:15.898Z","updated_at":"2026-10-10T07:49:15.898Z"}]}