{"event":{"id":"evt-2025q1-tsmc-expansion","dedupe_key":"historical_material_change:2025-03-03:tsmc-announces-additional-us-manufacturing-investment-plans","event_type":"historical_material_change","title":"TSMC announces additional US manufacturing investment plans","summary":"TSMC announced intended additional $100 billion US investment with new fabs, packaging facilities and an R&D center.","occurred_at":"2025-03-03T00:00:00.000Z","published_at":"2025-03-04T00:00:00.000Z","observed_at":"2026-10-09T19:12:47.000Z","reconstructed_at":"2026-10-09T19:12:47.000Z","ingest_type":"live_world_scan","locations":null,"status":"verified","confidence":0.97,"metadata":{"what_happened_at_time":"TSMC announced intended additional $100 billion US investment with new fabs, packaging facilities and an R&D center.","what_must_not_be_inferred":"The announcement is not completed capacity or disbursed investment; the primary release is issued March 4.","availability_status":"announced_investment_plan","affected_layers":["layer-manufacturing","layer-chips","layer-geopolitics"],"epistemic_status":"observed_fact"},"created_at":"2026-10-10T08:11:02.805Z","updated_at":"2026-10-10T08:11:02.805Z"},"artifacts":[{"id":"art-2025q1-tsmc-expansion","dedupe_key":"3f1094fdf40ff47cd5d414b290e7ed4a090d735950555219c61799c654404c5b","canonical_url":"https://pr.tsmc.com/english/news/3210","evidence_locator":"","artifact_type":"official_announcement","title":"TSMC announces additional US manufacturing investment plans","summary":"TSMC announced intended additional $100 billion US investment with new fabs, packaging facilities and an R&D center.","creator_entities":["TSMC"],"released_at":"2025-03-04T00:00:00.000Z","content_hash":null,"metadata":{"historical_scope":"2025-Q1"},"created_at":"2026-10-10T08:11:02.799Z","updated_at":"2026-10-10T08:11:02.799Z","relation":"documented_by"}],"signals":[{"id":"sig-2025q1-chips","statement":"Expanded future US fab/packaging intentions and diffusion controls shaped AI silicon planning and cross-border access.","signal_type":"historical_layer_delta","direction":"increasing","confidence":0.93,"epistemic_status":"supported_inference","mapping_mode":"retrospective","reconstructed_at":"2026-10-09T19:12:47.000Z","created_at":"2026-10-10T08:11:02.810Z","updated_at":"2026-10-10T08:11:02.810Z"},{"id":"sig-2025q1-geopolitics","statement":"US leadership policy, planned manufacturing/infrastructure expansion and diffusion controls reinforced strategic AI competition.","signal_type":"historical_layer_delta","direction":"increasing","confidence":0.93,"epistemic_status":"supported_inference","mapping_mode":"retrospective","reconstructed_at":"2026-10-09T19:12:47.000Z","created_at":"2026-10-10T08:11:02.812Z","updated_at":"2026-10-10T08:11:02.812Z"},{"id":"sig-2025q1-manufacturing","statement":"TSMC expanded intended US fabrication and packaging investment; new plants remained a future pipeline.","signal_type":"historical_layer_delta","direction":"increasing","confidence":0.93,"epistemic_status":"supported_inference","mapping_mode":"retrospective","reconstructed_at":"2026-10-09T19:12:47.000Z","created_at":"2026-10-10T08:11:02.811Z","updated_at":"2026-10-10T08:11:02.811Z"}]}